3D-Micromac Receives Order for Multiple Laser Lift-Off Systems for microLED Device Manufacturing - Display Daily

3D-Micromac AG, the manufacture person successful laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, solid and show markets, announced that a starring optical solutions supplier has purchased aggregate microMIRA™ Laser Lift-Off (LLO) systems from 3D-Micromac for usage successful the accumulation of microLED devices.

The lawsuit volition instal the caller microMIRA systems successful pilot- and accumulation lines astatine its state-of-the-art LED spot mill successful Asia.

Laser Lift-Off an Enabling Process for microLEDs

MicroLEDs person the imaginable to revolutionize the show industry, promising a assortment of advantages specified arsenic superior viewing angle, precocious dynamic scope with cleanable achromatic luminance and precocious brightness, wide colour gamut, accelerated refresh rates, agelong lifetime, and debased powerfulness consumption. Potential applications see precise ample displays for indoor and outdoor use, arsenic good arsenic high-resolution displays for augmented world (AR) and virtual world (VR) wearable devices.

However, the microLED fabrication process is vastly much analyzable than LCD and OLED manufacturing, and faces respective method challenges that indispensable beryllium flooded earlier microLEDs tin beryllium readily disposable successful the wide market. Among these challenges is detaching and transferring the processed microLED chips from the donor oregon maturation substrate (e.g., sapphire) to an intermediate substrate for consequent investigating without damaging the costly maturation substrate, allowing it to beryllium repurposed for aboriginal use. The microMIRA strategy from 3D-Micromac precisely addresses this task with superior performance.

The microMIRA™ laser strategy from 3D-Micromac provides highly uniform, force-free lift-off of antithetic layers connected large-area substrates astatine precocious processing speeds without the request for costly and polluting bedewed chemic processes.

3D-Micromac’s microMIRA strategy provides highly uniform, force-free lift-off of antithetic layers connected large-area substrates astatine precocious processing speeds without the request for costly and polluting bedewed chemic processes. The unsocial enactment beam strategy is built connected a highly customizable level that tin incorporated antithetic laser sources, wavelengths and beam paths to conscionable each customer’s unsocial requirements. The strategy is susceptible of processing antithetic substrate materials and sizes, and tin execute processing speeds (including handling) of up to 60 eight-inch wafers per hour.

According to Uwe Wagner, CEO of 3D-Micromac, “This aggregate strategy bid is simply a testament to our quality to supply innovative and enabling laser micromachining solutions for concern applications serving some mature and emerging markets. It besides represents an important milestone for 3D-Micromac arsenic we proceed to grow our merchandise offerings and services into the show industry, addressing the accumulation needs for breathtaking caller show technologies, including microLEDs. To date, 3D-Micromac has sold much than 10 laser processing systems for microLED applications, including our industry-benchmark microMIRA laser-lift-off strategy arsenic good arsenic our precocious introduced microCETI™ micromachining platform.”

The microMIRA LLO strategy has been utilized successfully successful wide accumulation by electronics manufacturers globally for years. In summation to gallium nitride (GaN) lift-off from solid and sapphire substrates successful microLED show manufacturing, the microMIRA strategy tin besides beryllium utilized for furniture separation successful semiconductor and sensor manufacturing, arsenic good arsenic for laser annealing and crystallization for aboveground modification.

Load larboard for wafer cassettes for the microMIRA laser system. The strategy is susceptible of processing antithetic substrate materials and sizes, and tin execute processing speeds (including handling) of up to 60 eight-inch wafers per hour. Source: 3D-Micromac.

About 3D-Micromac

Founded successful 2002, 3D-Micromac AG is the manufacture person successful laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior accumulation efficiency. We make processes, machines and turnkey solutions astatine the highest method and technological level. 3D-Micromac systems and services person been successfully implemented successful assorted high-tech industries worldwide, including photovoltaic, semiconductor, solid and show industries, micro diagnostics, and aesculapian technology.